Machine Vision Products Inc
Prestataire R&D privé Contact |
||
|
Téléphone :
Mail :
Adresse :
Bellman Way, Donibristle Industrial Park
Dunfermline, Scotland
Royaume-Uni
|
||
|
Consultez cette fiche en intégralité ? |
||
|
Consultez cette fiche et près de 50 000 autres fiches de Centres de Recherche dans plus de 30 pays européens sur Expernova.com !
Inscrivez-vous ou contactez-nous pour une démonstration personnalisée.
Il s’agit de votre centre de Recherche ? Inscrivez-vous gratuitement et complétez vos informations. |
||
|
|
||
|
|
||
|
Profil scientifique partiel |
||
|
|
||
|
Quelques documents de Machine Vision Products Inc
|
||
|
Development of comprehensive in-line quality control system for printed circuit board assemblies (MICROSCAN)
MICROSCAN Sujets :
Coordination, Cooperation, Policies, Innovation, Technology Transfer, Scientific Research, Evaluation
Other Indexes:PCB assembly,productive improvement,Quality assurance
Type de contrat :
No contract type
Participants :
TWI LTD UNITED KINGDOM
TWI LTD
TECHNOLOGY DEPARTMENT Granta Park, Great Abington UNITED KINGDOM
BETA ELECTRONICS LTD ÉIRE/IRELAND
BETA ELECTRONICS LTD
ENGINEERING DEPARTMENT Unit 1A, Centrepoint Business Park, Oak Road ÉIRE/IRELAND
INBOARD LEITERPLATTENTECHNOLOGIE GMBH DEUTSCHLAND
INBOARD LEITERPLATTENTECHNOLOGIE GMBH
NON-DESTRUCTIVE TESTING DEPARTMENT, TWI LTD Oestliche Rheinbrueckenstrasse 50 DEUTSCHLAND
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DEUTSCHLAND
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
INSTITUTE FOR MANUFACTURING, ENGINEEERING AND AUTOMATION DEPARTMENT OF TECHNICAL INFORMATION PROCESSING Hansastrasse 27C DEUTSCHLAND
LOT ORIEL GMBH & CO KG DEUTSCHLAND
LOT ORIEL GMBH & CO KG
Im Tiefen See 58 DEUTSCHLAND
GENTECH ELECTRONICS LTD ÉIRE/IRELAND
GENTECH ELECTRONICS LTD
Unit 7, Garryglass Industrial Estate, Ballysimon Road ÉIRE/IRELAND
KAUNAS UNIVERSITY OF TECHNOLOGY LIETUVA
KAUNAS UNIVERSITY OF TECHNOLOGY
ULTRASOUND RESEARCH CENTRE Donelaicio, 73 LIETUVA
INBOARD LEITERPLATTENTECHNOLOGIE Germany
INBOARD LEITERPLATTENTECHNOLOGIE
NON-DESTRUCTIVE TESTING DEPARTMENT, TWI LTD Oestliche Rheinbrueckenstrasse 50 Germany
LOT ORIEL & CO KG Germany
LOT ORIEL & CO KG
Im Tiefen See 58 Germany
BETA ELECTRONICS Ireland
BETA ELECTRONICS
ENGINEERING DEPARTMENT Unit 1A, Centrepoint Business Park, Oak Road Ireland
GENTECH ELECTRONICS Ireland
GENTECH ELECTRONICS
Unit 7, Garryglass Industrial Estate, Ballysimon Road Ireland
MICROTEL TECHNOLOGIE ELECTTRONICHE Italy
MICROTEL TECHNOLOGIE ELECTTRONICHE
Via G. Di Vitorio, 5 Italy
GOODRICH CONTROL SYSTEMS United Kingdom
GOODRICH CONTROL SYSTEMS
CHASSIS & POWERTRAIN CONTROLS C/o Ernst & Young, 400 Capability Green United Kingdom
MACHINE VISION PRODUCTS INC United Kingdom
MACHINE VISION PRODUCTS INC
Bellman Way, Donibristle Industrial Park United Kingdom
ULTRASONIC SCIENCES United Kingdom
ULTRASONIC SCIENCES
Unit 4, Springlakes Industrial Estate, Deadbrook Lane United Kingdom
X TEK SYSTEMS United Kingdom
X TEK SYSTEMS
Tring Business Centre, Ickneild Way United Kingdom
Microscan will produce a powerful tool in the total quality control of PCB assemblies, which can also reduce the cost of the manufacturing process and will provide an impetus to the PCB industry in Europe. It will greatly improve the employment prospects of the region as well as improving the quality of life, initially for Europe but then worldwide. In addition to the above this project will aid in the introduction of Lead free solder by developing the NDT techniques on a selection of lead free samples an d provide genuine environmental benefits. European Parliament Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment and Directive 2002/96EC on waste electrical and electronic equipment. T he project will complete this by developing a Non-Destructive system, which can provide full coverage of all defects in PCB manufacturing. Assembled PCBs can suffer from many defects. It is highly beneficial for these defects to be detected at the product ion stage, as failure in the field can result in massive financial costs tor the manufacturer which is then passed on to the consumer. There is no existing non-destructive testing (NDT) system, which incorporates all of the available techniques to form an integrated in-line quality control system. This gap in the market means that flaws will be missed and adds to the financial burden of the manufacturers and the whole European community. There are currently specific limitations to the NDT techniques and e quipment, which prevent them being combined in an integrated system, which can be operated in-line. The Microscan project will overcome the current limitations and develop new techniques for X-ray detection, develop novel improvements for AOI and innovati ve and novel acoustic and thermal techniques. It is intended that the developed systems will be combined with a PCB assembly system to produce new in-line inspections, providing full quality control of PCB assemblies.
Source :
cordis
|
||

cordis