Loctite (ireland)

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	Téléphone : Mail : Adresse : Tallaght Business Park 24 Dublin Irlande Web :

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	Quelques documents de Loctite (ireland)
	Metrology for anisotropic and lateral thermal transport in solids and thin films (METROTHERM) METROTHERM 2000 - 2003 Sujets : Reference Materials, Measurement Methods Type de contrat : Cost-sharing contracts Participants : LOCTITE (IRELAND) LIMITED ÉIRE/IRELAND LOCTITE (IRELAND) LIMITED Research,Industry RESEARCH DEVELOPMENT & ENGINEERING Tallaght Business Park, Whitestown 24 ÉIRE/IRELAND UNIVERSITY OF ULM DEUTSCHLAND UNIVERSITY OF ULM Education ABTEILUNG EXPERIMENTELLE PHYSIK - FAKULTÄT FÜR NATURWISSENSCHAFTEN Albert-Einstein-Alle 11 89081 DEUTSCHLAND OPTICAL METROLOGY INNOVATIONS LTD. ÉIRE/IRELAND OPTICAL METROLOGY INNOVATIONS LTD. Industry,Other 2200 Cork Airport Business Park Co ÉIRE/IRELAND ART-PHOTONICS GMBH DEUTSCHLAND ART-PHOTONICS GMBH Other Schwarzschildstrasse 6 12489 DEUTSCHLAND Loctite (Ireland) Ireland Loctite (Ireland) Industry Tallaght Business Park 24 Ireland OPTICAL METROLOGY INNOVATIONS Ireland OPTICAL METROLOGY INNOVATIONS Industry 2200 Cork Airport Business Park Co Ireland Radstone Technology United Kingdom Radstone Technology Industry Water Lane NN12 6JN United Kingdom Hide objective METROTHERM meets an urgent European industry need to support current developments in new materials with thermal metrology instrumentation. Affordable instrumentals are needed to map the lateral thermal transport in materials in multiple thin layer formats, which are unsuitable for measurement by existing methods. The project will leverage existing research expertise in Europe to deliver prototype instruments for exploitation by European companies within 12 months of completion. Thermal diffusivity mapping for a wide range of thermally conductive materials will be achieved. For low diffusivity samples thermally anisotropic, uniaxial electrically conductive adhesives (currently intended to replace lead-based solder) will be assessed for a consortium partner. Very high thermal conductivity materials being developed by an end user partner for electronic interconnection will have an efficient characterization method for the first time. Source : cordis   Metrology for anisotropic and lateral thermal transport in solids and thin films (METROTHERM) METROTHERM 2000 - 2003 Sujets : Reference Materials, Measurement Methods Type de contrat : Cost-sharing contracts Participants : LOCTITE (IRELAND) LIMITED ÉIRE/IRELAND LOCTITE (IRELAND) LIMITED Research,Industry RESEARCH DEVELOPMENT & ENGINEERING Tallaght Business Park, Whitestown 24 ÉIRE/IRELAND UNIVERSITY OF ULM DEUTSCHLAND UNIVERSITY OF ULM Education ABTEILUNG EXPERIMENTELLE PHYSIK - FAKULTÄT FÜR NATURWISSENSCHAFTEN Albert-Einstein-Alle 11 89081 DEUTSCHLAND OPTICAL METROLOGY INNOVATIONS LTD. ÉIRE/IRELAND OPTICAL METROLOGY INNOVATIONS LTD. Industry,Other 2200 Cork Airport Business Park Co ÉIRE/IRELAND ART-PHOTONICS GMBH DEUTSCHLAND ART-PHOTONICS GMBH Other Schwarzschildstrasse 6 12489 DEUTSCHLAND Loctite (Ireland) Ireland Loctite (Ireland) Industry Tallaght Business Park 24 Ireland OPTICAL METROLOGY INNOVATIONS Ireland OPTICAL METROLOGY INNOVATIONS Industry 2200 Cork Airport Business Park Co Ireland Radstone Technology United Kingdom Radstone Technology Industry Water Lane NN12 6JN United Kingdom Hide objective METROTHERM meets an urgent European industry need to support current developments in new materials with thermal metrology instrumentation. Affordable instrumentals are needed to map the lateral thermal transport in materials in multiple thin layer formats, which are unsuitable for measurement by existing methods. The project will leverage existing research expertise in Europe to deliver prototype instruments for exploitation by European companies within 12 months of completion. Thermal diffusivity mapping for a wide range of thermally conductive materials will be achieved. For low diffusivity samples thermally anisotropic, uniaxial electrically conductive adhesives (currently intended to replace lead-based solder) will be assessed for a consortium partner. Very high thermal conductivity materials being developed by an end user partner for electronic interconnection will have an efficient characterization method for the first time. Source : cordis